STM32F030C6T6

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产品类别
微控制器
简介说明
MCU 32-bit ARM Cortex M0 RISC 32KB Flash 2.5V/3.3V 48-Pin LQFP Tray
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微控制器
STMicroelectronics
EU RoHS COMPL
Family Name: STM32F
Family Name describes the family name for the product. It is mainly the name noted in the beginning of the datasheet.
Instruction Set Architecture: RISC
Instruction Set Architecture describes the set of instructions that a device is designed to execute.
Data Bus Width: 32
Data Bus Width describes the number of data lines in a given bus interconnect.
Number of Timers: 5
Number of Timers describes the number of device timers.
Program Memory Size: 32KB
Program Memory Size describes the size of total memory used for programming device.
Program Memory Type: Flash
Program Memory Type describes the different types of memory technologies used in electronic devices.
RAM Size: 4KB
RAM Size describes the size of Random Access Memory as in format (Mb | Kb | 128Kx16).
Interface Type: I2C/SPI/USART
Interface Type describes the boundary across which two independent systems meet and act on or communicate with each other.
ADC Channels: 12
On-Chip ADC describes the Number of ADC on microcontroller chip with it's resolution.
Maximum Clock Rate: 48
Maximum Clock Rate is fundamental rate in cycles per second (measured in hertz).
Maximum CPU Frequency: 48
Maximum Speed describes the maximum operating speed (frequency) that device can executes the instruction.
Operating Supply Voltage: 2.5|3.3
Operating Supply Voltage describes the nominal voltage that a circuit component needs in order to function properly.
Number of Programmable I/Os: 39
Number of Programmable I/Os is Number of I/O port supported by microcontroller chip.
Minimum Operating Temperature: -40
Minimum Operating Temperature describes the minimum temperature that the device can function correctly while working.
Packaging: Tray
Packaging describes the method of containing/packaging a product for delivery or sales.
Maximum Operating Temperature: 85
Maximum Operating Temperature describes the maximum temperature that the device can function correctly while working.
Minimum Operating Supply Voltage: 2.4
Minimum Operating Supply Voltage describes the minimum supply voltage at which a device is specified to operate in compliance with the applicable device specification.
Maximum Operating Supply Voltage: 3.6
Maximum Operating Supply Voltage describes the maximum supply voltage at which a device is specified to operate in compliance with the applicable device specification.
Device Core: ARM Cortex M0
Device Core is a technology of instruction set implementation.
Temperature Flag: Opr
Typical Operating Supply Voltage: 2.5|3.3
Typical Operating Supply Voltage describes the supply voltage at which a device is specified to operate in compliance with the applicable device specification.
Life Cycle: Active
Maximum Power Dissipation: 364
Maximum Power Dissipation describes the measure of the rate at which energy is dissipated, or lost, from a system.
Watchdog: 1
Watchdog describes the number of Watchdog timer found in the chip.
Minimum Storage Temperature: -65
Minimum Storage Temperature describes the minimum temperature at which the device can be safely stored when the device is not powered.
Maximum Storage Temperature: 150
Maximum Storage Temperature describes the maximum temperature at which the device can be safely stored when the device is not powered.
Programmability: Yes
Programmability describes the ability to make programming for any device in order to achieve especial task.
SPI: 1
SPI describes the Serial Peripheral Interface (SPI) is similar to the SCI, although it is used to communicate synchronously over shorter distances at up to 4 Mbit/s.
I2C: 1
I2C Is a bus is an inexpensive type of chip interconnection that is popular on circuit boards (pronounced "Eye Squared C").
I2S: 0
I2S also known as Inter-IC Sound, Integrated Interchip Sound, or IIS, is an electrical serial bus interface standard used for connecting digital audio devices together.
UART: 0
UART is a universal asynchronous receiver/transmitter is a piece of computer hardware that translates data between parallel and serial forms.
USART: 1
USART is a universal synchronous/asynchronous receiver/transmitter is a UART that can also communicate synchronously.
CAN: 0
CAN describes the Controller Area Network (CAN) protocol is a serial communication protocol originally developed by Robert Bosch for use in serial communication networks in vehicles.
USB: 0
USB is Universal Serial Port and this feature refers to the number of USB supported by the device.
Ethernet: 0
Ethernet is a family of frame-based computer networking technologies for local area networks (LANs). the name came from the physical concept of the ether. It defines a number of wiring and signaling standards for the Physical Layer of the OSI networking model as well as a common addressing format and Media Access Control at the Data Link Layer.
Number of ADCs: Single
Number of ADCs describes the number of internal ADCs.
Parallel Master Port: No
Parallel Master Port describes the methodology to use the Parallel Master Port (PMP) module to interface with external data memory, either external Flash or external RAM.
Real Time Clock: Yes
Real Time Clock describes clock that keeps track of the time even when the computer is turned off, RTC (Real time clock) run on a special battery that is not connected to the normal power supply
Temperature Grade: Industrial
Core Architecture: ARM
Core Architecture Describes the technology of instruction set implementation of microprocessor found in microcontroller chip, if it ARM or AVR or 8051.
ADC Resolution: 12
ADC Resolution describes as the number of bits of resolution for analog to digital converter on MCU
Direct Memory Access: Yes
Direct Memory Access describes the technique for the transfer of data between main memory and a peripheral device without passing it through the CPU, It is possible to achieve higher transmission speed by parallel work with CPU, because the DMA controller is used only for data transfer.
Floating Point Unit: No
Floating Point Unit describes a part of a MCU system specially designed to carry out operations on floating point numbers, Typical operations are addition, subtraction, multiplication, division, and square root.
Bluetooth: No
Bluetooth describes a telecommunications industry specification that describes how mobile phones, computers, and personal digital assistants (PDAs) can be easily interconnected using a short-range wireless connection by MCU.
Wi-Fi: No
WiFi describes a popular technology that allows an electronic device to exchange data wirelessly (using radio waves) over a computer network, including high-speed Internet connections.
Touch Sensing Interface: No
Touch Sensing Interface describes the touch sensitive transparent screen mounted, It provides a way for a person to interact with an computer system, Typically the system will display panel or buttons and expect the user to select one by touching it, The touch causes some measurable phenomena which is converted by a controller IC into screen coordinates which are sent into the system.
Power On Reset: No
Power On Reset describes an electronic device incorporated into the integrated circuit that detects the power applied to the chip and generates a reset impulse that goes to the entire circuit placing it into a known state, The POR is activated when the VCC rises and reaches the POR threshold voltage (VPOT), and this will start the reset sequence, The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level, The VPOT level is higher for falling VCC than for rising VCC.
Memory Protection Unit: No
Memory Protection Unit describes technique that prohibits one program from accidentally clobbering another active program. Using various different techniques, a protective boundary is created around the program, and instructions within the program are prohibited from referencing data outside of that boundary.
Temperature Sensor: Yes
Temperature sensor describes that uses an external diode-connected transistor as the sensing element to measure temperatures external to the sensor (for example, on a circuit board or on the die of a CPU). Generally produces a digital output.
DDR: No
DDR describes selection of the input or output direction for individual pins of the corresponding port that have been configured to function as general I/O pins.
Memory Management Unit: No
Memory Management Unit describes hardware component responsible for handling accesses to memory requested by the CPU. Its functions include translation of virtual addresses to physical addresses (i.e., virtual memory management), memory protection, cache control, bus arbitration and in simpler computer architectures (especially 8-bit systems) bank switching.
Integrated Development Environment: No
Integrated Development Environment describes the method that enables you to write, build, deploy and debug your C/C++ and assembler code, An integrated development environment (IDE) or interactive development environment is a software application that provides comprehensive facilities to computer programmers for software development. An IDE normally consists of a source code editor, build automation tools and a debugger.
Super Scalar: No
Super Scalar describes type of processor found in MCU that can execute multiple sets of instructions at the same time in parallel.a super scalar can have information sent directly to these units for processing while the main processor is busy with something else.
External Bus Interface: No
External Bus Interface describes the interface which designed to ensure the successful data transfer between several external devices and the processor-based device.
DMA Channels: 5
DMA Channels describes the number of channels found to transfer data between main memory and a peripheral device without passing it through the CPU.
Multiply Accumulate: No
Multiply Accumulate describes a common step that computes the product of two numbers and adds that product to an accumulator. The hardware unit that performs the operation is known as a multiplieraccumulator (MAC, or MAC unit), the operation itself is also often called a MAC or a MAC operation.
Input Capture Channels: 4
Input Capture Channels describes Input capture channels of dealing with input signals in an embedded system, the ability to trigger an output based on a timestamp in memory, without interrupting the execution of code by a processor or microcontroller. This is a functionality provided by many embedded systems as MCU.
Output Compare Channels: 4
Output Compare Channels describes Output compare channels of dealing with input signals in an embedded system, the ability to trigger an output based on a timestamp in memory, without interrupting the execution of code by a processor or microcontroller. This is a functionality provided by many embedded systems as MCU.
Internal/External Clock Type: Internal/External
Internal/External Clock Type describes the Type of source of the clock, External clock is installed within the microcontroller and connected to the OSC1 and OSC2, It is called external because it relies on external circuitry for the clock signal and frequency stabilization, such as a stand-alone oscillator, quarts crystal, ceramic resonator or resistor-capacitor circuit, Internal clock refers to the fact that this is the clocking source the whole controller uses, The oscillator responsible for it may well be external.
Tradename: STM32
Tradename describes the official name under which a company does business. It is also known as a doing business as name, assumed name, or fictitious name. A trade name does not afford any brand name protection or provide you with unlimited rights for the use of that name. However, registering a trade name is an important step for some but not all businesses.
Automotive: No
AEC Qualified Number: N/R
Base Material: Cu Alloy
CECC Qualified: No
Contains SVHC: NO
Diameter: N/R
DW Flag: N
ESD Protection: Yes
Exceed Limit: NO
Lead Finish Material: Au
Lead Shape: Gull-wing
Maximum Reflow Temperature: 260
Maximum Wave Temperature: N/R
Military Qualified: No
Moisture Sensitivity level: 3
Mounting: Surface Mount
Package Height: 1.4
Package Length: 7
Package Width: 7
PCB changed: 48
Pin Count: 48
Pin Count describes number of leads attached to package body or number of contact points for each component.
Pin Out: N
Schedule B: 8542310000
Standard Package Name: QFP
Supplier Package: LQFP
Tab: N/R
Under Plating Material: Pd over Ni