STL10N3LLH5

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产品类别
MOSFETs
简介说明
Trans MOSFET N-CH 30V 9A Automotive 8-Pin Power Flat T/R
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MOSFETs
STMicroelectronics
EU RoHS COMPL
Channel Mode: Enhancement
Channel Mode describes the feature that describes the operation mode of the channel, enhancement or depletion.
Channel Type: N
Channel Type describes The transistor channel type.
Configuration: Single Quad Drain Triple Source
Configuration describes the construction, arrangement or configuration of the device.
Maximum Drain Source Voltage: 30
Maximum Drain Source Voltage describes the maximum dc voltage between the drain and source terminals.
Maximum Gate Source Voltage: ±22
Maximum Gate Source Voltage describes dc voltage between the gate and source terminals.
Maximum Continuous Drain Current: 9
Maximum Continuous Drain Current describes the current which is carried by free electrons traveling from source to drain when a small voltage VDS is applied between drain and source.
Maximum Continuous Drain Current Range: 5 to 10
Maximum Continuous Drain Current Range describes the range of Maximum Continuous Drain Current.
Maximum Drain Source Resistance: 19@10V
Maximum Drain Source Resistance describes the maximum resistance between the drain and source terminals at on state at maximum or largest specified gate-source voltage condition taken from electrical characteristic tables.
Packaging: Tape and Reel
Packaging describes the method of containing/packaging a product for delivery or sales.
Minimum Operating Temperature: -55
Minimum Operating Temperature describes the minimum temperature that the device can function correctly while working.
Typical Gate Charge @ Vgs: 5@4.5V
Typical Gate Charge @ Vgs describes the charge on the gate terminal of the MOSFET determined by its Gate-to-Source capacitance.
Typical Input Capacitance @ Vds: 724@25V
Typical Input Capacitance @ Vds describes the input capacitance measured between the gate and source terminals with the drain shorted to the source for AC signals.
Typical Fall Time: 3.5
Typical Fall Time describes typical time required for the trailing edge of a pulse to fall from 90% to 10% of its amplitude.
Maximum Power Dissipation: 50000
Maximum Power Dissipation describes the measure of the rate at which energy is dissipated, or lost, from a system.
Typical Rise Time: 4.2
Typical Rise Time describes the time required for a signal to change from a specified low value to a specified high value.
Typical Turn-Off Delay Time: 21
Typical Turn-Off Delay Time describes the time interval between the moment when the gate-emitter voltage VGE has declined to 90 % of its initial value (VGG), and the drain-source voltage has risen to 10 % of the supply voltage (VDD).
Typical Turn-On Delay Time: 4
Typical Turn-On Delay Time describes the time interval between the moment when the gate-emitter voltage VGE has reached 10 % of its end value (VGG), and when the drain-source voltage has dropped to 90 % of its initial value (VDD).
Maximum Operating Temperature: 150
Maximum Operating Temperature describes the maximum temperature that the device can function correctly while working.
Temperature Flag: Stg/Jun
Category: Power MOSFET
Category describes the type, function or classification of the device.
Number of Elements per Chip: 1
Number of Elements per Chip describes the number of elements in each chip.
Life Cycle: Active
Minimum Storage Temperature: -55
Minimum Storage Temperature describes the minimum temperature at which the device can be safely stored when the device is not powered.
Maximum Storage Temperature: 150
Maximum Storage Temperature describes the maximum temperature at which the device can be safely stored when the device is not powered.
Process Technology: STripFET V
Process Technology describes the manufacturing process used to fabricate the integrated circuit, specified in the transistor technology, the minimum transistor gate length, and the connecting metal layers for the circuit elements.
Automotive: Yes
AEC Qualified Number: AEC-Q101
Base Material: Cu Alloy
Contains SVHC: NO
Diameter: N/R
Dose Level: N/A
DW Flag: N
ESD Protection: Unknown
Exceed Limit: NO
Lead Finish Material: Matte Sn annealed
Lead Shape: No Lead
Maximum Reflow Temperature: 260
Maximum Wave Temperature: N/R
Military Qualified: No
Moisture Sensitivity level: 1
Mounting: Surface Mount
Package Height: 0.95(Max)
Package Length: 3.3
Package Width: 3.3
PCB changed: 8
Pin Count: 8
Pin Count describes number of leads attached to package body or number of contact points for each component.
Pin Out: Y
Rad Hard: No
Schedule B: 8541290080
Supplier Package: Power Flat
Tab: N/R
Under Plating Material: N/A